Interpack

The packaging industry needs to find future-proof answers to existential challenges now more than ever before: How can we increase the number of products being packaged in a way that saves resources and energy? From May 4 to 10 at Interpack 2023 in Düsseldorf, Germany, Beckhoff, as a long-standing partner of the packaging industry, will showcase how PC-based control and our other innovative automation technology products make this possible: Intelligent transport systems such as XPlanar, XTS and NCT (No Cable Technology) combined with high-performance motion and drive solutions via EtherCAT and TwinCAT form the foundation for efficient machine concepts.

Discover our comprehensive portfolio at Interpack. See how our solutions are the perfect fit for your packaging machines. We look forward to seeing you there!