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VIP2010-1010 | Panel illumination, OGB-IR850, narrow beam, light emitting surface 100 x 100 mm

VIP2010-1010 | Panel illumination, OGB-IR850, narrow beam, light emitting surface 100 x 100 mm

VIP2010-1010 | Panel illumination, OGB-IR850, narrow beam, light emitting surface 100 x 100 mm

VIP2010-1010 | Panel illumination, OGB-IR850, narrow beam, light emitting surface 100 x 100 mm

Beam behavior of the illumination

VIP2010-1010 | Panel illumination, OGB-IR850, narrow beam, light emitting surface 100 x 100 mm

VIP2010-1010 | Panel illumination, OGB-IR850, narrow beam, light emitting surface 100 x 100 mm

VIP2010-1010 | Panel illumination, OGB-IR850, narrow beam, light emitting surface 100 x 100 mm

Beam behavior of the illumination

Cables and connectors overview

Cables and connectors overview

Cables and connectors overview

The VIP2010 narrow-beam panel light is designed for use in industrial image processing systems. The square light-emitting surface not only creates optimal illumination, but also ensures high-quality image acquisition when processing images. The thermally hardened front glass protects against chemical and mechanical environmental influences. The black anodized aluminum housing effectively dissipates the heat generated and reduces distracting light reflections.

Main light direction

  • incident light
  • transmitted light

Product status:

product announcement | estimated market release 1st quarter 2026

Product information

Technical dataVIP2010-1010
Product categoryillumination
Category/versionpanel illumination
Light colororange: 612 nm, green: 545 nm, blue: 452 nm, infrared: 853 nm, white: 6560 K, CRI >80
Light distributionnarrow beam
Beam angle50°
Light emitting surface (W x H)100 x 100 mm
Peak performance1200 W (electrical, VIS LEDs, max. 500 µs)
Power supplymode 1: EtherCAT P
mode 2: 24 V DC (-15%/+20%)
Max. power consumption60 W
Synchronizationmode 1: EtherCAT P
mode 2: Digital input
Connection method2 x M8, EtherCAT P socket, shielded, screw type, P-coded
Front glassthermally hardened
Operating temperature0…60°C
Protection ratingIP65/67
Dimensions (W x H x D)165 mm x 140 mm x 39.5 mm
Weight1.2 kg
Approvals/markingsCE, UL, UKCA, EAC, RoHS, WEEE
Material complianceVIP2010-1010
CAS No.7439-92-1
REACH SVHCLead
REACH Annex XVIIcompliant
REACH Annex XIVcompliant
SCIP No.SCIP submission in progress
POPcompliant
RoHScompliant with exemption
RoHS exemption7c-I: Lead-containing electrical and electronic components in glass and ceramic materials, excluding dielectric ceramics in capacitors, 7a: Lead in solders with a high melting point with a minimum mass fraction of 85% lead, 6c: Copper alloy with a mass fraction of up to 4% lead
CA Prop65www.beckhoff.com/prop65
DisclaimerThis statement and the information contained above are, to the best of our knowledge and belief, accurate, based on the information we have received from our suppliers. This information is in line with the current standard of technology and our suppliers’ technical documentation. The absence of the substances is not verified by Beckhoff Automation by means of analytical tests. When addressed to our customers any information contained in this document is subject to the terms and conditions expressed in the governing customer agreement. Our general terms and conditions apply.

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