MC6030-0080-2217 | IPC module, Industrial PC, Intel® Core™ i3/i5 of the 11th generation, M12, push-pull
MC6030-0080-2217 | IPC module, Industrial PC, Intel® Core™ i3/i5 of the 11th generation, M12, push-pull
The MX-System series | # 5: The IPC modules
The MC6030-0080-2217 IPC module enables an industrial PC to be integrated into the MX-System. The foundations for this are laid by the full integration and compatibility of TwinCAT and EtherCAT. The module can be used on the first slot of a 2- or 3-row baseplate.
Different options for the processor, main memory, and flash memory can be selected for the respective applications.
Product status:
regular delivery
Product information
| Technical data | MC6030-0080-2217 | Options |
|---|---|---|
| Product category | IPC modules | |
| Category/version | Intel® Core™ | |
| Processor | select from the processor option list at an additional cost | up to 11th generation Intel® Core™ i5 11500HE 2.0 GHz, 6 cores (TC3: 70) |
| Slots for hard disk/flash | 2 slots on-board for M.2 SSD, 1 slot M.2 2280 SSD (rear side) | |
| Operating system | selection from the option list at an additional cost | |
| Memory | select from the DRAM option list at an additional cost | up to 32 GB DDR4 RAM |
| Hard disks/flash | select from the SSD option list at an additional cost | up to 640 GB M.2 SSD |
| Interfaces | 1 x Ethernet 10/100/1000 Mbit/s (M12),
1 x Ethernet 100/1000/2500 Mbit/s (M12), 1 x EtherCAT OUT (M12), 1 x power I/O (M12), 2 x mini DisplayPort (push-pull), 2 x USB 3.1 Gen. 2 (push-pull) | |
| Housing data | R2S2T3 |
|---|---|
| Baseplate interface | data connector |
| Number of data slots | 1 |
| Operating temperature | 0…50°C |
| Storage temperature | -25…+60°C |
| Protection rating | IP65/67 |
| Approvals/markings | CE, UL (in preparation) |
| Mandatory SSD options | Select one of these options for your configuration |
|---|---|
| C9900-H594 | 40 GB M.2 SSD, 3D flash, extended temperature range, for C603x, C6040, MC603x |
| C9900-H595 | 80 GB M.2 SSD, 3D flash, extended temperature range, for C603x, C6040, MC603x |
| C9900-H596 | 160 GB M.2 SSD, 3D flash, extended temperature range, for C603x, C6040, MC603x |
| C9900-H615 | 320 GB M.2 SSD, 3D flash, extended temperature range, for C603x, C6040, MC603x |
| C9900-H676 | 640 GB M.2 SSD, 3D flash, extended temperature range, for C603x, C6040, MC603x |
| Mandatory DRAM options | Select one of these options for your configuration |
|---|---|
| C9900-R297 | 4 GB DDR4 RAM SODIMM, 1 SODIMM with 4 GB |
| C9900-R298 | 8 GB DDR4 RAM SODIMM, 1 SODIMM with 8 GB |
| C9900-R299 | 16 GB DDR4 RAM SODIMM, 1 SODIMM with 16 GB |
| C9900-R300 | 32 GB DDR4 RAM SODIMM, 1 SODIMM with 32 GB |
| Mandatory CPU options | Select one of these options for your configuration |
|---|---|
| C9900-C652 | processor 11th generation Intel® Core™ i3-11100HE, 2.0 GHz, 4 cores (TC3: 60) |
| C9900-C653 | processor 11th generation Intel® Core™ i5-11500HE, 2.0 GHz, 6 cores (TC3: 70) |
| Options | MC6030-0080-2217 |
|---|---|
| C9900-S512 | Windows 10 IoT Enterprise 2021 LTSC, 64 bit, German, for Industrial PCs with Intel® Celeron®, Pentium®, Core™ i3 or Core™ i5 |
| C9900-S513 | Windows 10 IoT Enterprise 2021 LTSC, 64 bit, English, for Industrial PCs with Intel® Celeron®, Pentium®, Core™ i3 or Core™ i5 |
| C9900-S539 | Windows 11 IoT Enterprise 2024 LTSC, 64 bit, German, for Industrial PCs with Intel® Celeron®, Pentium®, Core™ i3 or Core™ i5 from the 8th generation |
| C9900-S540 | Windows 11 IoT Enterprise 2024 LTSC, 64 bit, English, for Industrial PCs with Intel® Celeron®, Pentium®, Core™ i3 or Core™ i5 from the 8th generation |
Operating systems Windows 10 IoT Enterprise 2021 LTSC, 64 bit, and Windows 11 IoT Enterprise 2024 LTSC, 64 bit
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| Material compliance | MC6030-0080-2217 |
|---|---|
| CAS No. | 7439-92-1 |
| REACH SVHC | Lead |
| REACH Annex XVII | compliant |
| REACH Annex XIV | compliant |
| SCIP No. | SCIP submission in progress |
| POP | compliant |
| RoHS | compliant with exemption |
| RoHS exemption | 6c: Copper alloy with a mass fraction of up to 4% lead, 7c-I: Lead-containing electrical and electronic components in glass and ceramic materials, excluding dielectric ceramics in capacitors |
| CA Prop65 | www.beckhoff.com/prop65 |
| Disclaimer | This statement and the information contained above are, to the best of our knowledge and belief, accurate, based on the information we have received from our suppliers. This information is in line with the current standard of technology and our suppliers’ technical documentation. The absence of the substances is not verified by Beckhoff Automation by means of analytical tests. When addressed to our customers any information contained in this document is subject to the terms and conditions expressed in the governing customer agreement. Our general terms and conditions apply. |
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