MS1020-8011-2255 | Power infeed, 24 V DC/10 A, 600 V DC/20 A, DC link capacity, B23
MS1020-8011-2255 | Power infeed, 24 V DC/10 A, 600 V DC/20 A, DC link capacity, B23
The MS1xxx series system modules supply the baseplates with protective extra-low voltages and low voltages. The MS1020-8011-2255 power infeed module provides 600 V DC and 20 A or 24 V DC and up to and 10 A for the system. The power is supplied via a hybrid connector. The module thus enables the integration of a baseplate into an existing EtherCAT topology.
In addition, the MS1020-8001-2255 has integrated DC link capacity.
Product status:
regular delivery
Product information
| Technical data | MS1020-8011-2255 |
|---|---|
| Product category | system modules |
| Category/version | power infeed |
| Input voltage/current, external | 24 V DC/10 A, 600 V DC/20 A |
| Connection technology infeed, external | B23 connector |
| Capacity | yes |
| Housing data | R2S2T3 |
|---|---|
| Baseplate interface | data and power connector |
| Number of data slots | 1 |
| Number of power slots | 1 |
| Operating temperature | 0…50°C |
| Storage temperature | -25…+60°C |
| Protection rating | IP65/67 |
| Approvals/markings | CE, UL (in preparation) |
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| Material compliance | MS1020-8011-2255 |
|---|---|
| CAS No. | 7439-92-1 |
| REACH SVHC | Lead |
| REACH Annex XVII | compliant |
| REACH Annex XIV | compliant |
| SCIP No. | SCIP submission in progress |
| POP | compliant |
| RoHS | compliant with exemption |
| RoHS exemption | 6c: Copper alloy with a mass fraction of up to 4% lead, 7a: Lead in solders with a high melting point with a minimum mass fraction of 85% lead, 7c-I: Lead-containing electrical and electronic components in glass and ceramic materials, excluding dielectric ceramics in capacitors |
| CA Prop65 | www.beckhoff.com/prop65 |
| Disclaimer | This statement and the information contained above are, to the best of our knowledge and belief, accurate, based on the information we have received from our suppliers. This information is in line with the current standard of technology and our suppliers’ technical documentation. The absence of the substances is not verified by Beckhoff Automation by means of analytical tests. When addressed to our customers any information contained in this document is subject to the terms and conditions expressed in the governing customer agreement. Our general terms and conditions apply. |
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